Sr. Reliability Engineer - Thermal Analysis at Acacia Communications
Maynard, MA, US

Location:          Maynard, MA   

FLSA Status:    Exempt

 

Job Description: 

Perform thermal/mechanical analysis and reliability to understand and identify potential issues in Acacia’s ultra-high speed and compact optical packages and subassemblies.

 

Key Essential Functions:

 

  • Model the thermal and mechanical stress in different packaging schemes and design tests to validate the results obtained through modeling, as well as provide guidelines and requirements in hybrid packaging
  • Drive analysis and perform tests to identify the weak points of package design and lead needed corrective actions
  • Work closely with design team, performs thermal mechanical analysis and modelling for new products over operating temperature range
  • Work closely with manufacturing team, performs thermal mechanical margin analysis and modelling for production process
  • Define thermal reliability tests and DOE tests to identify and correct issues early during NPI life cycle
  • Work with internal quality team and suppliers on related failure and root cause analysis
  • Clearly communicate thermal evaluation results, risks and impacts
  • Participate in DFMEA/PFMEA assessments
  • Serve as thermal reliability expert for component, IC, and product designs
  • Work closely with design teams to optimize product reliability prior to production 

Other Requirements:

 

  • Perform other duties as assigned

 

Minimum Qualifications, Experience, Skills, Education and Certifications:

 

  • Master’s degree or above in material, mechanical, or electrical engineering
  • 8+ years of experience on chip architecture, package, and PCB thermal analysis
  • Knowledge of the following:
    • Material properties and thermal structural solutions
    • Physics level failure analysis and root cause analysis
    • Statistical modelling capability including Weibull Analysis
    • Industry standard reliability qualification methods and standards
    • Advanced semiconductor device structure and package process is a plus
  • Familiar with the following:
    • Electronics and semiconductor packaging and PCBA assembly processes
    • Packaging process of electronic devices and assemblies in terms of thermal and mechanical stress as well as failure mechanisms.     
    • Long term reliability requirements and failure modes related to thermal and mechanical stress, understanding relevant Telcordia and Mil standards
    • Optical and electronic packing schemes and thermal mechanical characteristics of material, including silicon die, substrate, PCB, solder paste, glass and thermal interface material, metal housing and electronic components

 

Physical/Travel Requirements:

 

  • None

 

All qualified applicants will receive consideration for employment without regard to race, color, religion, sex, sexual orientation, gender identity, national origin, disability, or veteran status.